The POLOS® Print UV Standard is a compact, maskless lithography system built on Digital Micromirror Device (DMD) projection technology. It enables direct patterning of micron-scale 2D features without the need for physical photomasks. Compatible with a broad range of photoresists and substrate materials, the system offers exceptional flexibility for rapid prototyping and research-driven microfabrication.
By projecting digital designs directly onto the substrate, the Print UV Standard allows users to create complex patterns with high precision while significantly reducing turnaround time and operating costs.
Key features
- Writing resolution as fine as 1.5 µm
- Exchangeable objectives for adjustable resolution and exposure field
- Accepts CAD layouts and bitmap image files
- Compatible with i-line, h-line, and g-line photoresists
- Supports a wide variety of substrates, including silicon, glass, metals, and plastics
- Handles sample sizes up to 5” square
- Integrated camera system for accurate alignment and positioning
Key benefits
- Eliminates the cost and delay of hard-mask fabrication
- Fast and intuitive alignment with real-time design overlay
- Tabletop system with minimal laboratory footprint
- Ideal for rapid iteration and development in advanced microfabrication workflows
Technical specifications
- Exposure wavelength: 385 nm
- Alignment wavelength: 590 nm
- Minimum feature size: 1.5 µm
- Alignment accuracy: 2 µm
- Maximum exposure area: 70 × 70 mm²
- Substrate size: Up to 100 mm (4") wafers
- Writing speed: Up to 75 mm²/min
- System dimensions: 52 (W) × 52 (H) × 69 (D) cm
Typical applications
- Microfluidic devices
- Microelectronics
- Optoelectronic components
- Spintronic structures
- 2D material patterning
- Biotechnology and lab-on-chip development
Options and accessories
- Multiple-sample holders (glass slide, 4” wafer and more)
- Interchangeable objectives for tailored resolution and field size
